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Global Cloud EDA Market to Reach US$9.1 Billion by the Year 2026 – Yahoo Finance

Another 286,000 Americans filed, higher than expected and from the previous week
Abstract: Global Cloud EDA Market to Reach US$9. 1 Billion by the Year 2026 . Electronic design automation (EDA) encompasses hardware, software and specific services to streamline the planning, implementation, design, validation and production of semiconductor chips or devices.
New York, Jan. 20, 2022 (GLOBE NEWSWIRE) — Reportlinker.com announces the release of the report "Global Cloud EDA Industry" – https://www.reportlinker.com/p05956313/?utm_source=GNW
EDA has been witnessing increasing acceptance among semiconductor chip or device makers owing to rising sophistication of these components, with some of the next-generation devices containing substantially large number of circuit elements. Cloud EDA paves the way for companies in reducing the time to market and in speeding up any innovation at maintained or lower operating costs. The advent of robust security measures for physical and technology resources, moreover, has created an environment for the semiconductor segment in which EDA cloud computing is as indispensable as a foundry is to the manufacturing of IC wafers today. As IC enterprises look more at leveraging more cloud capacities for ensuring more rapid turnaround times, particularly on cutting edge designs of process nodes, a clear comprehension of all cloud EDA options, costs and benefits can aid them in making decisions that best support their respective resources and needs.

Amid the COVID-19 crisis, the global market for Cloud EDA estimated at US$6.6 Billion in the year 2020, is projected to reach a revised size of US$9.1 Billion by 2026, growing at a CAGR of 5.6% over the analysis period. Semiconductor Intellectual Property (SIP), one of the segments analyzed in the report, is projected to grow at a 6.3% CAGR to reach US$3.5 Billion by the end of the analysis period. After a thorough analysis of the business implications of the pandemic and its induced economic crisis, growth in the Computer Aided Engineering (CAE) segment is readjusted to a revised 6.9% CAGR for the next 7-year period. This segment currently accounts for a 25.7% share of the global Cloud EDA market. Semiconductor IP (SIP) refers to reusable design aspects including chip layout, and cell among other components used in manufacturing advanced Integrated Circuits (IC). The demand for computer-aided engineering (CAE) software is being driven by increasing focus of companies to outsource manufacturing tasks to various emerging economies like China, India and Russia. The integrated software helps companies in dealing with various issues associated with product prototyping along with recall.

The U.S. Market is Estimated at $2 Billion in 2021, While China is Forecast to Reach $1.4 Billion by 2026

The Cloud EDA market in the U.S. is estimated at US$2 Billion in the year 2021. The country currently accounts for a 29.08% share in the global market. China, the world`s second largest economy, is forecast to reach an estimated market size of US$1.4 Billion in the year 2026 trailing a CAGR of 6.9% through the analysis period. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 4.6% and 5.3% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 5% CAGR while Rest of European market (as defined in the study) will reach US$531.2 Million by the end of the analysis period.

IC Physical Design & Verification Segment to Reach $1.8 Billion by 2026

In the global IC Physical Design & Verification segment, USA, Canada, Japan, China and Europe will drive the 4.4% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$1.1 Billion in the year 2020 will reach a projected size of US$1.4 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$318.8 Million by the year 2026.

Select Competitors (Total 36 Featured)

Agnisys Inc.
Aldec, Inc.
ANSYS, Inc.
Cadence Design Systems, Inc.
JEDA Technologies, Inc.
Mentor Graphics Corporation
MunEDA GmbH
Synopsys, Inc.
Zuken

Read the full report: https://www.reportlinker.com/p05956313/?utm_source=GNW

I. METHODOLOGY

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW
Moving to the Cloud is a Matter of Survival for Companies in
the 21st Century
EXHIBIT 1: Cloud is a Matter of Survival, A Urgent Business
Need for Businesses to Stay Afloat & Excel in Competitive
Markets: Global Market for Cloud Computing Services (In US$
Billion) for Years 2021, 2023, 2025 and 2027
The Race Between the Virus & Vaccines Intensifies. Amidst this
Chaotic Battle, Where is the World Economy Headed in 2021?
These are Times When Questions Abound & Answers Are Few
So How Fast Or Slow Are We Moving?
EXHIBIT 2: How & When Will the World Be Vaccinated? Global
Number of Annual COVID-19 Vaccine Doses (In Million) for Years
2020 through 2025 by Geographic Region/Country
Split Scenarios Unfold: The Great Vaccine Divide Emerges
EXHIBIT 3: Vaccine Imbalances to Stretch the Pandemic Further
into 2022: Global Percentage (%) of Population Administered
With Vaccines by Region as of October 2021
EXHIBIT 4: Time is of Essence! What We Know So Far – ?Vaccine
Efficiency against New Strains is Decreasing?
Progress on Vaccinations, Why Should Businesses Care?
With IMF?s Upward Revision of Global GDP Forecasts for 2021,
Most Companies Are Bullish About an Economic Comeback Despite
a Continuing Pandemic
EXHIBIT 5: A Strong Yet Exceedingly Patchy & Uncertain Recovery
Shaped by New Variants Comes Into Play: World Economic Growth
Projections (Real GDP, Annual % Change) for 2020 through 2022
EXHIBIT 6: Easing Unemployment Levels in 2021 Although Moderate
Will Infuse Hope for Industries Reliant on Consumer
Discretionary Incomes: Global Number of Unemployed People (In
Million) for Years 2019, 2020, 2021, and 2022
Electronic Design Automation (EDA) & Cloud EDA: Definition,
Importance & Benefits
Companies Move EDA Into the Cloud. Here?s Why
Recent Market Activity

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS
The Storm Wrought by the Pandemic Changes Competitive Dynamics,
Forcing Semiconductor Leaders to Weave New Strategies to
Survive Post Pandemic Times
EDA & IP Are Two Sides of the Same Coin. Competitive Pressure
to Secure IPs Push Up Willingness to Invest in Cloud EDA
EXHIBIT 7: IP Cores per SoC
EXHIBIT 8: The Race to Secure IP Increases Reliance on
Innovative EDA Tools to Rapidly Design Chips, Especially Cloud
EDA: Global Semiconductor (Silicon) Intellectual Property:
(SIP) (In US$ Million) for Years 2021, 2023, 2025 and 2027
Semiconductor Industry Comes Under Extreme Pressure to
Outperform as Time-to-Market Challenges Worsens
Pushed to Innovate Semiconductor Companies Adopt Cloud Based
EDA Tools
Cloud EPA to Tackle Challenges Arising from Growing
Complexities in Chip Design
EDA in the Cloud Holds Key in Rapidly Innovating SoC Design
Accelerating Advanced Networking SoC Design with Cloud-Based
Emulation
Robust Outlook for CAD, CAM and CAE to Bring Cheer to the Cloud
EDA Market
EXHIBIT 9: With Adoption of Engineering Software Reaching
Mainstream, Focus Now Shifts to Migration to the Cloud: Global
Market for Engineering Software (CAD, CAM, CAE, AEC, & EDA)
(In US$ Billion) for Years 2021, 2023, 2025 and 2027
Advent of Autonomous Vehicles and Rising Demand for Connected
Cars to Boost Need for Innovative Chip Design
EXHIBIT 10: Autonomous Cars & Vehicle Electronification Push Up
the Need for Rapid Designing of Innovative Chips: Global
Market for Autonomous Vehicles (In Units) for Years 2021,
2023, 2025 and 2027
Healthy Demand for PCBs Bodes Well for Market Growth
EXHIBIT 11: Faster Time-to-Market Need Pushes EDA for PCB
Design into the Cloud: Global Opportunity for Printed Circuit
Boards (PCBs) (In US$ Billion) for Years 2021, 2023, 2025 and
2027

4. GLOBAL MARKET PERSPECTIVE
Table 1: World Current & Future Analysis for Cloud EDA by
Geographic Region – USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets – Independent Analysis
of Annual Revenues in US$ Million for Years 2020 through 2027
and % CAGR

Table 2: World 7-Year Perspective for Cloud EDA by Geographic
Region – Percentage Breakdown of Value Revenues for USA,
Canada, Japan, China, Europe, Asia-Pacific and Rest of World
Markets for Years 2021 & 2027

Table 3: World Current & Future Analysis for Semiconductor
Intellectual Property (SIP) by Geographic Region – USA, Canada,
Japan, China, Europe, Asia-Pacific and Rest of World Markets –
Independent Analysis of Annual Revenues in US$ Million for
Years 2020 through 2027 and % CAGR

Table 4: World 7-Year Perspective for Semiconductor
Intellectual Property (SIP) by Geographic Region – Percentage
Breakdown of Value Revenues for USA, Canada, Japan, China,
Europe, Asia-Pacific and Rest of World for Years 2021 & 2027

Table 5: World Current & Future Analysis for Computer Aided
Engineering (CAE) by Geographic Region – USA, Canada, Japan,
China, Europe, Asia-Pacific and Rest of World Markets –
Independent Analysis of Annual Revenues in US$ Million for
Years 2020 through 2027 and % CAGR

Table 6: World 7-Year Perspective for Computer Aided
Engineering (CAE) by Geographic Region – Percentage Breakdown
of Value Revenues for USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World for Years 2021 & 2027

Table 7: World Current & Future Analysis for IC Physical Design &
Verification by Geographic Region – USA, Canada, Japan,
China, Europe, Asia-Pacific and Rest of World Markets –
Independent Analysis of Annual Revenues in US$ Million for
Years 2020 through 2027 and % CAGR

Table 8: World 7-Year Perspective for IC Physical Design &
Verification by Geographic Region – Percentage Breakdown of
Value Revenues for USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World for Years 2021 & 2027

Table 9: World Current & Future Analysis for Printed Circuit
Board (PCB) & Multi-Chip Module (MCM) by Geographic Region –
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World Markets – Independent Analysis of Annual Revenues in US$
Million for Years 2020 through 2027 and % CAGR

Table 10: World 7-Year Perspective for Printed Circuit Board
(PCB) & Multi-Chip Module (MCM) by Geographic Region –
Percentage Breakdown of Value Revenues for USA, Canada, Japan,
China, Europe, Asia-Pacific and Rest of World for Years 2021 &
2027

Table 11: World Current & Future Analysis for Military /
Defense by Geographic Region – USA, Canada, Japan, China,
Europe, Asia-Pacific and Rest of World Markets – Independent
Analysis of Annual Revenues in US$ Million for Years 2020
through 2027 and % CAGR

Table 12: World 7-Year Perspective for Military / Defense by
Geographic Region – Percentage Breakdown of Value Revenues for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World for Years 2021 & 2027

Table 13: World Current & Future Analysis for Aerospace by
Geographic Region – USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets – Independent Analysis
of Annual Revenues in US$ Million for Years 2020 through 2027
and % CAGR

Table 14: World 7-Year Perspective for Aerospace by Geographic
Region – Percentage Breakdown of Value Revenues for USA,
Canada, Japan, China, Europe, Asia-Pacific and Rest of World
for Years 2021 & 2027

Table 15: World Current & Future Analysis for Telecom by
Geographic Region – USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets – Independent Analysis
of Annual Revenues in US$ Million for Years 2020 through 2027
and % CAGR

Table 16: World 7-Year Perspective for Telecom by Geographic
Region – Percentage Breakdown of Value Revenues for USA,
Canada, Japan, China, Europe, Asia-Pacific and Rest of World
for Years 2021 & 2027

Table 17: World Current & Future Analysis for Automotive by
Geographic Region – USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets – Independent Analysis
of Annual Revenues in US$ Million for Years 2020 through 2027
and % CAGR

Table 18: World 7-Year Perspective for Automotive by Geographic
Region – Percentage Breakdown of Value Revenues for USA,
Canada, Japan, China, Europe, Asia-Pacific and Rest of World
for Years 2021 & 2027

Table 19: World Current & Future Analysis for Other
Applications by Geographic Region – USA, Canada, Japan, China,
Europe, Asia-Pacific and Rest of World Markets – Independent
Analysis of Annual Revenues in US$ Million for Years 2020
through 2027 and % CAGR

Table 20: World 7-Year Perspective for Other Applications by
Geographic Region – Percentage Breakdown of Value Revenues for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World for Years 2021 & 2027

III. MARKET ANALYSIS

UNITED STATES
Table 21: USA Current & Future Analysis for Cloud EDA by
Product Segment – Semiconductor Intellectual Property (SIP),
Computer Aided Engineering (CAE), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-Chip
Module (MCM) – Independent Analysis of Annual Revenues in US$
Million for the Years 2020 through 2027 and % CAGR

Table 22: USA 7-Year Perspective for Cloud EDA by Product
Segment – Percentage Breakdown of Value Revenues for
Semiconductor Intellectual Property (SIP), Computer Aided
Engineering (CAE), IC Physical Design & Verification and
Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the
Years 2021 & 2027

Table 23: USA Current & Future Analysis for Cloud EDA by
Application – Military / Defense, Aerospace, Telecom,
Automotive and Other Applications – Independent Analysis of
Annual Revenues in US$ Million for the Years 2020 through 2027
and % CAGR

Table 24: USA 7-Year Perspective for Cloud EDA by Application –
Percentage Breakdown of Value Revenues for Military / Defense,
Aerospace, Telecom, Automotive and Other Applications for the
Years 2021 & 2027

CANADA
Table 25: Canada Current & Future Analysis for Cloud EDA by
Product Segment – Semiconductor Intellectual Property (SIP),
Computer Aided Engineering (CAE), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-Chip
Module (MCM) – Independent Analysis of Annual Revenues in US$
Million for the Years 2020 through 2027 and % CAGR

Table 26: Canada 7-Year Perspective for Cloud EDA by Product
Segment – Percentage Breakdown of Value Revenues for
Semiconductor Intellectual Property (SIP), Computer Aided
Engineering (CAE), IC Physical Design & Verification and
Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the
Years 2021 & 2027

Table 27: Canada Current & Future Analysis for Cloud EDA by
Application – Military / Defense, Aerospace, Telecom,
Automotive and Other Applications – Independent Analysis of
Annual Revenues in US$ Million for the Years 2020 through 2027
and % CAGR

Table 28: Canada 7-Year Perspective for Cloud EDA by
Application – Percentage Breakdown of Value Revenues for
Military / Defense, Aerospace, Telecom, Automotive and Other
Applications for the Years 2021 & 2027

JAPAN
Table 29: Japan Current & Future Analysis for Cloud EDA by
Product Segment – Semiconductor Intellectual Property (SIP),
Computer Aided Engineering (CAE), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-Chip
Module (MCM) – Independent Analysis of Annual Revenues in US$
Million for the Years 2020 through 2027 and % CAGR

Table 30: Japan 7-Year Perspective for Cloud EDA by Product
Segment – Percentage Breakdown of Value Revenues for
Semiconductor Intellectual Property (SIP), Computer Aided
Engineering (CAE), IC Physical Design & Verification and
Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the
Years 2021 & 2027

Table 31: Japan Current & Future Analysis for Cloud EDA by
Application – Military / Defense, Aerospace, Telecom,
Automotive and Other Applications – Independent Analysis of
Annual Revenues in US$ Million for the Years 2020 through 2027
and % CAGR

Table 32: Japan 7-Year Perspective for Cloud EDA by Application –
Percentage Breakdown of Value Revenues for Military /
Defense, Aerospace, Telecom, Automotive and Other Applications
for the Years 2021 & 2027

CHINA
Table 33: China Current & Future Analysis for Cloud EDA by
Product Segment – Semiconductor Intellectual Property (SIP),
Computer Aided Engineering (CAE), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-Chip
Module (MCM) – Independent Analysis of Annual Revenues in US$
Million for the Years 2020 through 2027 and % CAGR

Table 34: China 7-Year Perspective for Cloud EDA by Product
Segment – Percentage Breakdown of Value Revenues for
Semiconductor Intellectual Property (SIP), Computer Aided
Engineering (CAE), IC Physical Design & Verification and
Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the
Years 2021 & 2027

Table 35: China Current & Future Analysis for Cloud EDA by
Application – Military / Defense, Aerospace, Telecom,
Automotive and Other Applications – Independent Analysis of
Annual Revenues in US$ Million for the Years 2020 through 2027
and % CAGR

Table 36: China 7-Year Perspective for Cloud EDA by Application –
Percentage Breakdown of Value Revenues for Military /
Defense, Aerospace, Telecom, Automotive and Other Applications
for the Years 2021 & 2027

EUROPE
Table 37: Europe Current & Future Analysis for Cloud EDA by
Geographic Region – France, Germany, Italy, UK and Rest of
Europe Markets – Independent Analysis of Annual Revenues in US$
Million for Years 2020 through 2027 and % CAGR

Table 38: Europe 7-Year Perspective for Cloud EDA by Geographic
Region – Percentage Breakdown of Value Revenues for France,
Germany, Italy, UK and Rest of Europe Markets for Years 2021 &
2027

Table 39: Europe Current & Future Analysis for Cloud EDA by
Product Segment – Semiconductor Intellectual Property (SIP),
Computer Aided Engineering (CAE), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-Chip
Module (MCM) – Independent Analysis of Annual Revenues in US$
Million for the Years 2020 through 2027 and % CAGR

Table 40: Europe 7-Year Perspective for Cloud EDA by Product
Segment – Percentage Breakdown of Value Revenues for
Semiconductor Intellectual Property (SIP), Computer Aided
Engineering (CAE), IC Physical Design & Verification and
Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the
Years 2021 & 2027

Table 41: Europe Current & Future Analysis for Cloud EDA by
Application – Military/Defense, Aerospace, Telecom, Automotive
and Other Applications – Independent Analysis of Annual
Revenues in US$ Million for the Years 2020 through 2027 and %
CAGR

Table 42: Europe 7-Year Perspective for Cloud EDA by
Application – Percentage Breakdown of Value Revenues for
Military / Defense, Aerospace, Telecom, Automotive and Other
Applications for the Years 2021 & 2027

FRANCE
Table 43: France Current & Future Analysis for Cloud EDA by
Product Segment – Semiconductor Intellectual Property (SIP),
Computer Aided Engineering (CAE), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-Chip
Module (MCM) – Independent Analysis of Annual Revenues in US$
Million for the Years 2020 through 2027 and % CAGR

Table 44: France 7-Year Perspective for Cloud EDA by Product
Segment – Percentage Breakdown of Value Revenues for
Semiconductor Intellectual Property (SIP), Computer Aided
Engineering (CAE), IC Physical Design & Verification and
Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the
Years 2021 & 2027

Table 45: France Current & Future Analysis for Cloud EDA by
Application – Military / Defense, Aerospace, Telecom,
Automotive and Other Applications – Independent Analysis of
Annual Revenues in US$ Million for the Years 2020 through 2027
and % CAGR

Table 46: France 7-Year Perspective for Cloud EDA by
Application – Percentage Breakdown of Value Revenues for
Military / Defense, Aerospace, Telecom, Automotive and Other
Applications for the Years 2021 & 2027

GERMANY
Table 47: Germany Current & Future Analysis for Cloud EDA by
Product Segment – Semiconductor Intellectual Property (SIP),
Computer Aided Engineering (CAE), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-Chip
Module (MCM) – Independent Analysis of Annual Revenues in US$
Million for the Years 2020 through 2027 and % CAGR

Table 48: Germany 7-Year Perspective for Cloud EDA by Product
Segment – Percentage Breakdown of Value Revenues for
Semiconductor Intellectual Property (SIP), Computer Aided
Engineering (CAE), IC Physical Design & Verification and
Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the
Years 2021 & 2027

Table 49: Germany Current & Future Analysis for Cloud EDA by
Application – Military / Defense, Aerospace, Telecom,
Automotive and Other Applications – Independent Analysis of
Annual Revenues in US$ Million for the Years 2020 through 2027
and % CAGR

Table 50: Germany 7-Year Perspective for Cloud EDA by
Application – Percentage Breakdown of Value Revenues for
Military / Defense, Aerospace, Telecom, Automotive and Other
Applications for the Years 2021 & 2027

ITALY
Table 51: Italy Current & Future Analysis for Cloud EDA by
Product Segment – Semiconductor Intellectual Property (SIP),
Computer Aided Engineering (CAE), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-Chip
Module (MCM) – Independent Analysis of Annual Revenues in US$
Million for the Years 2020 through 2027 and % CAGR

Table 52: Italy 7-Year Perspective for Cloud EDA by Product
Segment – Percentage Breakdown of Value Revenues for
Semiconductor Intellectual Property (SIP), Computer Aided
Engineering (CAE), IC Physical Design & Verification and
Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the
Years 2021 & 2027

Table 53: Italy Current & Future Analysis for Cloud EDA by
Application – Military / Defense, Aerospace, Telecom,
Automotive and Other Applications – Independent Analysis of
Annual Revenues in US$ Million for the Years 2020 through 2027
and % CAGR

Table 54: Italy 7-Year Perspective for Cloud EDA by Application –
Percentage Breakdown of Value Revenues for Military /
Defense, Aerospace, Telecom, Automotive and Other Applications
for the Years 2021 & 2027

UNITED KINGDOM
Table 55: UK Current & Future Analysis for Cloud EDA by Product
Segment – Semiconductor Intellectual Property (SIP), Computer
Aided Engineering (CAE), IC Physical Design & Verification and
Printed Circuit Board (PCB) & Multi-Chip Module (MCM) –
Independent Analysis of Annual Revenues in US$ Million for the
Years 2020 through 2027 and % CAGR

Table 56: UK 7-Year Perspective for Cloud EDA by Product
Segment – Percentage Breakdown of Value Revenues for
Semiconductor Intellectual Property (SIP), Computer Aided
Engineering (CAE), IC Physical Design & Verification and
Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the
Years 2021 & 2027

Table 57: UK Current & Future Analysis for Cloud EDA by
Application – Military / Defense, Aerospace, Telecom,
Automotive and Other Applications – Independent Analysis of
Annual Revenues in US$ Million for the Years 2020 through 2027
and % CAGR

Table 58: UK 7-Year Perspective for Cloud EDA by Application –
Percentage Breakdown of Value Revenues for Military / Defense,
Aerospace, Telecom, Automotive and Other Applications for the
Years 2021 & 2027

REST OF EUROPE
Table 59: Rest of Europe Current & Future Analysis for Cloud
EDA by Product Segment – Semiconductor Intellectual Property
(SIP), Computer Aided Engineering (CAE), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-Chip
Module (MCM) – Independent Analysis of Annual Revenues in US$
Million for the Years 2020 through 2027 and % CAGR

Table 60: Rest of Europe 7-Year Perspective for Cloud EDA by
Product Segment – Percentage Breakdown of Value Revenues for
Semiconductor Intellectual Property (SIP), Computer Aided
Engineering (CAE), IC Physical Design & Verification and
Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the
Years 2021 & 2027

Table 61: Rest of Europe Current & Future Analysis for Cloud
EDA by Application – Military / Defense, Aerospace, Telecom,
Automotive and Other Applications – Independent Analysis of
Annual Revenues in US$ Million for the Years 2020 through 2027
and % CAGR

Table 62: Rest of Europe 7-Year Perspective for Cloud EDA by
Application – Percentage Breakdown of Value Revenues for
Military / Defense, Aerospace, Telecom, Automotive and Other
Applications for the Years 2021 & 2027

ASIA-PACIFIC
Table 63: Asia-Pacific Current & Future Analysis for Cloud EDA
by Product Segment – Semiconductor Intellectual Property (SIP),
Computer Aided Engineering (CAE), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-Chip
Module (MCM) – Independent Analysis of Annual Revenues in US$
Million for the Years 2020 through 2027 and % CAGR

Table 64: Asia-Pacific 7-Year Perspective for Cloud EDA by
Product Segment – Percentage Breakdown of Value Revenues for
Semiconductor Intellectual Property (SIP), Computer Aided
Engineering (CAE), IC Physical Design & Verification and
Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the
Years 2021 & 2027

Table 65: Asia-Pacific Current & Future Analysis for Cloud EDA
by Application – Military / Defense, Aerospace, Telecom,
Automotive and Other Applications – Independent Analysis of
Annual Revenues in US$ Million for the Years 2020 through 2027
and % CAGR

Table 66: Asia-Pacific 7-Year Perspective for Cloud EDA by
Application – Percentage Breakdown of Value Revenues for
Military / Defense, Aerospace, Telecom, Automotive and Other
Applications for the Years 2021 & 2027

REST OF WORLD
Table 67: Rest of World Current & Future Analysis for Cloud EDA
by Product Segment – Semiconductor Intellectual Property (SIP),
Computer Aided Engineering (CAE), IC Physical Design &
Verification and Printed Circuit Board (PCB) & Multi-Chip
Module (MCM) – Independent Analysis of Annual Revenues in US$
Million for the Years 2020 through 2027 and % CAGR

Table 68: Rest of World 7-Year Perspective for Cloud EDA by
Product Segment – Percentage Breakdown of Value Revenues for
Semiconductor Intellectual Property (SIP), Computer Aided
Engineering (CAE), IC Physical Design & Verification and
Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the
Years 2021 & 2027

Table 69: Rest of World Current & Future Analysis for Cloud EDA
by Application – Military / Defense, Aerospace, Telecom,
Automotive and Other Applications – Independent Analysis of
Annual Revenues in US$ Million for the Years 2020 through 2027
and % CAGR

Table 70: Rest of World 7-Year Perspective for Cloud EDA by
Application – Percentage Breakdown of Value Revenues for
Military / Defense, Aerospace, Telecom, Automotive and Other
Applications for the Years 2021 & 2027

IV. COMPETITION
Total Companies Profiled: 36
Read the full report: https://www.reportlinker.com/p05956313/?utm_source=GNW

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SYDNEY (Reuters) -Qantas Airways Ltd will seek to terminate contract terms with long-haul flight attendants, the carrier said on Thursday, in a move that would bring large pay cuts, after union members voted against more flexible rostering. Qantas said it was the first time in its history it had sought to terminate an employment terms agreement, or a contract between employers and unions, which is a rare and heated move in industrial relations in Australia. If it succeeds, cabin crew pay and conditions would revert to a much lower Australian minimum industry standard while a new pact is negotiated.
After beating the market in 2020, Cathie Wood underwhelmed in 2021. Her focus on disruptive tech stocks meant that her company, Ark Invest, was susceptible to a pullback as that sector tumbled last year due to economic instability and wildly high valuations.
(Bloomberg) — European natural gas slumped as a top LNG importer in China prepares to flood the market with fuel that could further ease supply concerns in the continent. Most Read from BloombergMicrosoft Buys Scandal-Tainted Activision in Bet on MetaverseStocks Extend Declines as Nasdaq Turns Lower Again: Markets WrapEarly Omicron Breakthroughs Show MRNA Vaccines’ WeaknessCovid-19 Infected Lions Prompt Variant Warning in South AfricaFourth Pfizer Dose Is Insufficient to Ward Off Omicron, Israe
You might have missed it if you blinked because it wasn't something Starbucks' corporate wanted to promote. In Buffalo, New York, a Starbucks location became the company's first to form a union. Here is what you need to know about the potential investment impact of a unionized Starbucks workforce.
Activision Blizzard Inc's Chief Executive Officer Bobby Kotick has gone from defending his handling of sexual harassment and discrimination claims at the video game maker to preparing to walk away with a windfall of at least $390 million. The 58-year-old executive stands to receive the payday after clinching a deal on Tuesday to sell Activision to Microsoft Corp for $68.7 billion, but the vast majority will come from the 3.95 million Activision shares he owns, regulatory filings show. He will miss out on a change of control payment because he doesn't own any unvested equities, which is uncommon for public company CEOs.
Brian Sozzi and Julie Hyman analyze the top news this week as Unilever walks away from a $68 billion deal, Instagram tests letting U.S. content creators charge subscriptions, and Amazon launches its first physical clothing store in Glendale, California.
McDonald's is expanding its test of the plant-based McPlant sandwich, co-developed with Beyond Meat, to the San Francisco and Dallas-Ft. Worth areas
Walmart's top e-commerce executive Casey Carl is leaving the company at the end of February after nearly two years, the company said in an internal memo. Carl will be replaced by Tom Ward, Walmart's senior vice president of last mile deliveries. Ward's new title will be executive vice president and chief e-commerce officer starting February 1.
U.S. rig counts are up by 228 vs. a year ago to 601, as Permian Basin output hits a record. That's good news for oil service giants Baker Hughes and Schlumberger.

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